The batch system V10-G is designed for the removal of photoresists. Furthermore it can be optimally used for the cleaning of wafers.
**Areas of application**
- Ideal system for removing photoresist layers (also SU-8) after dry processes like RIE or Ion Beam etching as well as after high dose implant processes
- Silicon wafers or other substrate cleaning prior wet processing to achieve a better wettability for an uniform and efficient result
- Applicable for processes in MEMS and nano technology
- Polymer removal e.g. after Bosch processes
- Removal of organic sacrificial layers