Product Details
**For MCM/Flip Chip/Eutectic and Ultrasonic.** The MAT 6400 die attach system helps achieve the goal of a solid foundation by using a high resolution digital vision system to ensure a pick and placement accuracy of 3 um @ 3 sigma (Application dependent). The fully automated system is designed for flexibility and improved quality. **Features include:** - The flexibility of the adhesive dispensing system allows single and multi dot patterns to be applied from a library of dispense patterns or the development of custom patterns for a specific project/customer application. The pin transfer process, stamping, has the capability of applying adhesive dots 75 micron and under. - Flip chip processing is easily handled with inline bump fluxing as well as over and up looking cameras to ensure accurate chip placement and alignment. - Heating of the substrate and tools are available to ensure the quality of the eutectic and thermo compression bonding processes. - Die stacking is another advanced feature of this equipment.