**The UV Laser cuts substrates in the immediate vicinity of sensitive components or strip conductors - without mechanical stress.**
Smaller components can thus be produced with a noticeably higher assembly density up to the edge of the PCB - and at the same time the process reduces the reject rate.
- Circuit board thickness up to 1.6 mm
- Close to strip conductors or components
- Optimal utilization of the substrate.
- The MicroLine 2000 S seamlessly integrates into existing manufacturing execution systems (MESs).