Product Details
**MicroLine 2000 S - Cutting Assembled Circuit Boards.** **The UV Laser cuts substrates in the immediate vicinity of sensitive components or strip conductors - without mechanical stress.** Smaller components can thus be produced with a noticeably higher assembly density up to the edge of the PCB - and at the same time the process reduces the reject rate. - Circuit board thickness up to 1.6 mm - Close to strip conductors or components - Optimal utilization of the substrate. - The MicroLine 2000 S seamlessly integrates into existing manufacturing execution systems (MESs).