Product Details
**MicroLine 2000 P- Processing Flat Substrates.** **UV Laser Cutting systems display their advantages at various positions in the production chain. With complex electronics components, the processing of flat materials is sometimes required.** The LPKF MicroLine 2000 P is optimized for these work steps. - Complex contours - No substrate brackets or cutting tools - More panels on the base material - Perforations and decaps. - The MicroLine 2000 P seamlessly integrates into existing manufacturing execution systems (MESs).