**UV Laser Cutting systems display their advantages at various positions in the production chain. With complex electronics components, the processing of flat materials is sometimes required.**
The LPKF MicroLine 2000 P is optimized for these work steps.
- Complex contours
- No substrate brackets or cutting tools
- More panels on the base material
- Perforations and decaps.
- The MicroLine 2000 P seamlessly integrates into existing manufacturing execution systems (MESs).