Our advanced Wire Bonders are specifically engineered for multi-purpose applications in research and development, as well as small series production. These semi-automatic tools are designed with a focus on robustness, reliability, and ease of use, ensuring they meet the diverse needs of your PCB assembly processes.
#### Key Features of Our Wire Bonding Equipment
**Versatile Bonding Capabilities:** Our equipment supports various bonding techniques, including wedge bonding, ball bonding, and bump bonding. Whether working with aluminum, gold, or ribbon wires, our bonders deliver precise and consistent results.
#### WB100e Manual & Semi-Automatic Wire Bonder:
- Equipped with a motorized Z-axis for enhanced control and precision.
- Large bonding height capability to accommodate various components.
- Offers full manual Z bonding for flexible application needs.
- Includes an XY manipulator for easy and accurate positioning.
#### WB200e Manual & Semi-Automatic Wire Bonder:
- Features vibration-free operation for superior bond quality.
- Programmable X & Y bond locations ensure precise and repeatable results.
- Integrated motorized Z-axis for advanced control during bonding.
- Large bonding height capability for handling a wide range of applications.
- Offers full manual Z bonding with additional features such as Auto-Bond mode for precision bonding.
- Loop control and a vertical camera with crosshair for exact placement and monitoring.
Our wire bonders are not only built for durability but also for flexibility, making them ideal for a variety of applications. Whether you are conducting R&D or managing small-scale production, these tools are designed to meet your exact needs with precision and ease.
