Wire Bonding

### Wire Bonding Solutions for R&D and Small-Scale Production Our advanced Wire Bonders are specifically engineered for multi-purpose applications in research and development, as well as small series production. These semi-automatic tools are designed with a focus on robustness, reliability, and ease of use, ensuring they meet the diverse needs of your PCB assembly processes.  #### Key Features of Our Wire Bonding Equipment **Versatile Bonding Capabilities:** Our equipment supports various bonding techniques, including wedge bonding, ball bonding, and bump bonding. Whether working with aluminum, gold, or ribbon wires, our bonders deliver precise and consistent results. #### WB100e Manual & Semi-Automatic Wire Bonder: - Equipped with a motorized Z-axis for enhanced control and precision. - Large bonding height capability to accommodate various components. - Offers full manual Z bonding for flexible application needs. - Includes an XY manipulator for easy and accurate positioning. #### WB200e Manual & Semi-Automatic Wire Bonder: - Features vibration-free operation for superior bond quality. - Programmable X & Y bond locations ensure precise and repeatable results. - Integrated motorized Z-axis for advanced control during bonding. - Large bonding height capability for handling a wide range of applications. - Offers full manual Z bonding with additional features such as Auto-Bond mode for precision bonding. - Loop control and a vertical camera with crosshair for exact placement and monitoring. Our wire bonders are not only built for durability but also for flexibility, making them ideal for a variety of applications. Whether you are conducting R&D or managing small-scale production, these tools are designed to meet your exact needs with precision and ease.