Users have full control over advanced performance accelerators, including repeatability, multi-level pulsing, and high-speed communication. This high level of responsiveness delivers actionable insights and enables more complex plasma applications than previously possible, providing a new depth of control. As a result, higher yield is achieved through fast and agile process control, delivering superior repeatability, faster tuning, and customized wave shaping.

Features

• Power accuracy and repeatability
• Multi-level pulsing (four user definable levels)
• Customizable frequency tuning per level
• Versatile arc management
• Digital metrology and intuitive graphical user interface
• Digital system control for advanced manufacturing technologies

Benefits

• Seamless integration into process systems
• Ultra-fast plasma process control
• Tighter repeatability delivers improved yield
• Fast configurable rise/fall time of pulsing
• Consistent process and wafer level uniformity