Mulilayer Fabrication is although a very simple term but in reality it is a very complex process of manufacturing today's high count and dense multilayer PCB's. Multilayer Fabrication consists of following steps :
- Multilayer Registration
- Vaccum Lamination

Multilayer registration are basically systems which are used for creating a registration between different layers of same PCB. These systems are normally vision based.

Vaccum Lamination is basically to laminate together the different layers of PCB using prepared material under high temperature and vaccum conditions. 

A good registration and vaccum lamination system ensures a high yield for PCB manufacturing plant and high reliability of PCB's being manufactured.

**VACUUM LAMINATING PRESSES **
**Type RMV 125, 200 and 250 with thermal oil heating and cooling**
Lauffer laminating systems offer leading-edge technology, production efficiency with maximum availability and durability "Made in Germany". Laboratory Press, Manual single press or fully automated Laminationcenter for mass production

VACUUM LAMINATING PRESSES- Type RMV 125, 200 and 250

The IPE-V is an affordable post etch punch built to the same specifications as punches two to three times their price. This compact machine is perfect for lower volume pcb manufacturers that need the tight tolerances but not the through put of our faster more expensive models. The IPE incorporates a small die set into the machine so the punches remain in register and with minimal wear, a problem exhibited on competitors lower cost units.

IPE-V

**Multilayer Registration Doesn’t Have to Be Like Trying to Hit a Moving Target!**

Optiline PE- the first of a diverse line of Multiline post etch punches the OPE offers flexibility and dependability in a machine which has been proven in PCB facilities throughout the world. The OPE incorporates a very accurate precision ground and jig ground interchangeable punch and die system which allows adjustability from 10" x 12" ( mm) to 24" x 30" ( mm). Large format machines are available up to 30" x 54"( mm). This interchangeable punch and die construction provides an easy to maintain machine which limits down time during sharpening to minutes not days.

Optiline PE

The Thermal Bonding System registers inner layers for lamination by bonding the layers to each other with multiple spots of heat. By applying heat to the area the pre-preg kicks over and bonds the material in the selected areas holding the layers in registration to each other.

The Thermal Bonder is a combination lay up station bonding unit. A double draw pinning station is provided with adjustable pins in the same tooling positions as ther post etch punch. The inner layers are punched on the post etch punch and then pinned together on the Thermal Bonder pinning station. This is more accurate than other bonding systems that use vision and clamping of the layers since the layers are pinned throughout the entire lay up process.

The double draw lay up station speeds up production. The operator lays up one packager while another is going through the bonding cycle.

**General Requirements:**

-  Loading and unloading from machine front.
- Six bonding heads along two sides. Additional bonding heads can be added to predefined locations in both x and y axis.
- Bonding pressure, dwell time and temperature are user configurable.

TBM-Thermal Bond

A worn or defective lamination pin or bushing may be very difficult to detect, especially by the naked eye. A lamination pin, after some usage, may become worn, mushroomed or bent. Notably, lamination bushings are also susceptible to wear such as hole enlargement or closing. While some of these defects may be determined by the uses of conventional inspection equipment, it can be very time consuming and often confusing. Using the carefully designed Multiline gages, all the problems associated with the inspection of pins and bushings can now be eliminated.

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