Our Laser Depaneling / Cutting Systems offer flexible and precise technology tailored to meet the diverse needs of modern PCB manufacturing. Designed to handle a wide variety of applications and processes, these systems provide unmatched accuracy and efficiency.

Key Features:

Flexible and Precise Technology: Engineered for precise depaneling and cutting, our systems adapt to various PCB manufacturing needs, ensuring clean and accurate results every time.

Versatile Applications: Capable of handling a broad range of cutting jobs, these systems are suitable for various applications and materials, making them an invaluable asset in any PCB production line.

Customizable Options: Choose from different laser sources, laser powers, wavelengths, and pulse widths to meet your specific production requirements, ensuring optimal performance for your unique applications.

Performance Benefits: Our systems are known for their accuracy, cleanliness, cost-effectiveness, and productivity, while also being versatile and material-saving—offering a comprehensive solution for PCB depaneling.

Machine Availability: Available in both stand-alone and inline versions, with standard working area options, to seamlessly integrate into your production workflow.

User-Friendly Interface: Simplify process and job setup with our intuitive Windows-based software, allowing for easy operation and quick adjustments to meet production demands.

Enhance your PCB manufacturing process with our cutting-edge Laser Depaneling / Cutting Systems, designed for precision, efficiency, and versatility.