Wire Bonding Solutions for R&D and Small-Scale Production

Our advanced Wire Bonders are specifically engineered for multi-purpose applications in research and development, as well as small series production. These semi-automatic tools are designed with a focus on robustness, reliability, and ease of use, ensuring they meet the diverse needs of your PCB assembly processes.

Key Features of Our Wire Bonding Equipment

Versatile Bonding Capabilities: Our equipment supports various bonding techniques, including wedge bonding, ball bonding, and bump bonding. Whether working with aluminum, gold, or ribbon wires, our bonders deliver precise and consistent results.

WB100e Manual & Semi-Automatic Wire Bonder:

• Equipped with a motorized Z-axis for enhanced control and precision.
• Large bonding height capability to accommodate various components.
• Offers full manual Z bonding for flexible application needs.
• Includes an XY manipulator for easy and accurate positioning.

WB200e Manual & Semi-Automatic Wire Bonder:

• Features vibration-free operation for superior bond quality.
• Programmable X & Y bond locations ensure precise and repeatable results.
• Integrated motorized Z-axis for advanced control during bonding.
• Large bonding height capability for handling a wide range of applications.
• Offers full manual Z bonding with additional features such as Auto-Bond mode for precision bonding.
• Loop control and a vertical camera with crosshair for exact placement and monitoring.

Our wire bonders are not only built for durability but also for flexibility, making them ideal for a variety of applications. Whether you are conducting R&D or managing small-scale production, these tools are designed to meet your exact needs with precision and ease.