### Advanced Vacuum Soldering Systems for Void-Free Soldering

Achieve high-quality solder connections with our cutting-edge vacuum soldering systems, specifically designed to meet the demanding requirements of modern electronic components such as power modules, hybrid, and multichip components. As the power density of these components continues to rise, ensuring the reliability and performance of solder connections has never been more critical.

#### Key Features of Our Vacuum Soldering Systems:

Void-Free Solder Connections: Our vacuum soldering technology systematically eliminates gas inclusions (voids) from the liquid solder, ensuring perfect, void-free solder joints essential for high-performance applications.

**High-Quality Production:** Engineered for excellence, our systems deliver superior soldering results, even for large power modules, using preform solders and solder pastes in a continuous, controlled process.

**Optimized for Advanced Components:** Designed to handle the increasing power density of advanced electronic components, our vacuum soldering solutions meet the rigorous quality demands of today’s electronics manufacturing.

**Intelligent Temperature Management:** Benefit from short cycle times and high throughput thanks to our advanced temperature management system, which ensures consistent and efficient soldering performance.

**Environmentally Friendly Design:** Our vacuum soldering systems are not only powerful but also environment-friendly, featuring a smart design that is easy to operate and maintain.

**Flexible Soldering Technologies:** We offer customizable soldering solutions tailored to meet individual customer requirements, ensuring that our systems align with your specific production needs.

**Reproducible Results:** Our continuous process control guarantees perfect and reproducible soldering results, making our systems the ideal choice for high-reliability applications.

With our vacuum soldering systems, you can achieve unparalleled soldering quality and reliability, ensuring that your electronic components meet the highest standards of performance and durability.

**For R&D and small series production**
 
**Compact and reliable**
The compact soldering system VADU 100 is equipped with separate zones for soldering and cooling and can be operated with paste as well as preforms.

Due to its small dimensions and the easy operation, the batch system is very suitable for production of small series and in laboratories for research applications.

VADU 100 Soldering system

**Soldering of substrates and wafers in series production**
 
The soldering system of type VADU200XL is equipped with two separate process chambers and can be operated with paste as well as preforms.

This allow the precise control of all relevant process parameters e.g. the temperature gradients during heating and cooling. Due to its intelligent temperature management the system provides short cycle times and an excellent temperature stability.

VADU 200XL

**Automated inline soldering system for series production**
 
The soldering system VADU 300XL is equipped with three separate process chambers with internal substrate handling and inline carrier transfer for highly efficient series production.

The VADU 300XL can also be integrated in customer‘s automation processes. PINK develops solutions according to customer‘s requirements which range from the optimization of the carrier handling through surrounding transfer systems to connection with pick-and-place machines and robot automation.

VADU 300XL

**Automated inline soldering system for series production**
 
The soldering system VADU 400XL is equipped with four separate process chambers with internal substrate handling and inline carrier transfer for highly efficient series production. The system enables void-free solder connections with preforms and /or pastes in a continuous process. 

The VADU 400XL can also be integrated in customer‘s automation processes.

Advanced Vacuum Soldering Systems for Void-Free Soldering

Key Features of Our Vacuum Soldering Systems:

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