### Advanced Micro Material Process PCBA Solutions for Precision and Versatility

Our Micro Material Process PCBA systems are designed to offer unparalleled precision and versatility in PCB assembly, utilizing cutting-edge laser technology to achieve exceptional results. The small focal spot size of the laser beam enables us to produce cut channels with widths as narrow as 15 µm, ensuring precise corner radii and sharp cut edges. This level of accuracy makes our laser systems particularly advantageous for high-frequency (HF) applications where precision is critical.

#### Key Features:

**Cold Ablation of Thin Films:** Leveraging picosecond lasers, our systems perform cold ablation on various thin films, opening up new possibilities in material processing. The ultrashort pulse width minimizes thermal effects, making it ideal for machining delicate layers used in OLED lighting and complex thin-film solar cells.

**Large Bandwidth and Versatile Applications:** Our laser systems offer a broad range of options, making them suitable for a variety of materials and applications. The ability to process different substrates with precision ensures that your PCBA needs are met with the highest standards.

**Gentle Machining of Laminated Materials:** Utilizing lasers in the “green” range of the visible light spectrum, our ProtoLaser S4 is optimized for surface machining of PCB materials. This gentle approach is perfect for working with laminated materials such as FR4 boards, ensuring the integrity of the material is maintained.

**Precision Machining of Ceramics:** The ProtoLaser U4, equipped with a UV laser source, excels in machining ceramics. It can structure metal layers on ceramic substrates like Al2O3, score ceramics, and is particularly effective for processing Low-Temperature Co-fired Ceramics (LTCCs) through structuring, cutting, and drilling.

![PASTE PRINTER (4).jpg](/uploads/PASTE_PRINTER_4_c96318d046.jpg)

Our Micro Material Process PCBA solutions are at the forefront of PCB assembly technology, delivering precise, reliable, and versatile machining capabilities. Whether you're working with delicate thin films, laminated materials, or ceramics, our systems provide the precision you need to achieve exceptional results.

Europlacer’s ep700 series printers combine the company’s commitment to high performance and reliability with outstanding value. The platform has been developed to cope with the rigors of high volume SMT production. Yet it incorporates the flexibility needed to deliver the fast set-up and product changeovers demanded by low and medium volume operations working in high-mix environments.

Designed with ease of use, high-end performance and low cost of ownership in mind, the platform utilises the most advanced drive control technology available, including 1 micron resolution linear encoders on all axes. A suite of intuitive software enables total control of the printing process.

The printers are fully equipped, as standard, with many features such as automatic rail width adjust, auto stencil loading, a fully programmable Under Stencil Cleaner and even automatic stencil paste inspection. In fact, everything you need to complete the SMT print process without exception or compromise.

The vision system utilises a unique Dual Roving camera (DRc) method for automatic board and stencil alignment. Not only does this innovative vision system provide the highest level of alignment capability, it also incorporates SmartCal.

INLINE SMT SCREEN PRINTER EP710

The LPKF ProtoLaser U4 uses a UV laser source. Many material groups are easy to process at these wavelengths – without additional tools, masks, or films. The LPKF ProtoLaser U4 builds on the success of its predecessor and expands its range of applications with targeted innovations.

**The LPKF ProtoLaser U4 features the new LPKF design, combining a classy look with clever solutions for operation and maintenance. The control PC is integrated into the ProtoLaser U4.**

**Stabilization of the Low-Energy Range**
Delicate, sensitive processes do not require a lot of laser energy, but rather especially little. Multiple processing produces highly precise structures on sensitive substrates. The new UV laser source is now stabilized across a large performance range. It can now safely process additional material groups and thin layers.

LPKF Protolaser U4

The LPKF ProtoLaser S4 features the new LPKF design, combining a classy look with clever solutions for operation and maintenance. Integration of the control PC is optional.  The ProtoLaser S4 is a valuable tool in the electronics lab. It can quickly and accurately generate fine structures and uses a special procedure for ablating large areas. The laser process requires no masks or tools to produce one-offs or individual marks.

**Expanded Process Window**
Switching to a green laser wavelength increases the range of applications. A green laser is much less likely to burn the substrate. It can also reliably machine inhomogeneous metal layers up to 6 μm in thickness – e. g., boards with fully metallized surfaces following galvanic via plating. The ProtoLaser S4 can cut rigid or flexible substrates efficiently with thicknesses of up to 0.8 mm.

ProtoLaser S4

An important parameter in the laser microprocessing of materials is the pulse width. The LPKF ProtoLaser R4 with picosecond-fast laser pulses allows for extremely precise structuring of delicate substrates and cutting of hardened or fired technical substrates.

• Precision picosecond lasers for innovative research

• Nondamaging processing of heat-sensitive materials

• Intuitive CAM software

• Ready-to-use laser class 1 laboratory system



Advanced Micro Material Process PCBA Solutions for Precision and Versatility

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