### Advanced Low-Pressure Plasma Systems for Versatile PCB Assembly Applications

Our Low-Pressure Plasma Systems stand for high-quality and precision, offering solutions that cater to a wide range of plasma processes in PCB assembly. Designed to meet the demands of both production and research and development, our product range includes everything from compact tabletop devices to robust stand-alone systems, each engineered for optimal performance.

#### Key Features:

**Compact and Versatile:** Our entry-level V6-G tabletop device is ideal for low-pressure plasma applications in batch production and R&D test series, providing a compact yet powerful solution for diverse needs.

**Customizable Stand-Alone Systems:** Our stand-alone systems can be customized to suit different plasma-producing frequencies and capacities, making them adaptable for various plasma processes in PCB assembly.

**High-Quality Construction:** Every system is built to the highest quality standards, ensuring reliable and consistent performance across all applications.

**Flexible Plasma Applications:** These systems are designed for versatility, enabling users to perform a wide range of plasma processes, from surface activation and cleaning to etching and coating, all within a controlled environment.

**User-Friendly Design:** With an emphasis on ease of use, our systems feature intuitive controls and robust construction, making them suitable for both seasoned professionals and those new to plasma technology.

![plasma equipment](/uploads/Untitled_design_17_3cc0ead939.jpg)

Whether you're working in batch production or conducting R&D, our Low-Pressure Plasma Systems offer the flexibility, precision, and reliability you need to achieve superior results in your PCB assembly processes.

**Standard systems for activation, cleaning, coating, etching**
 

The standard unit V6-G is designed as a tabletop device for industrial small series production as well as for the low-pressure plasma treatment in R&D laboratories. It can be used for the surface treatment processes cleaning and activation.

The integrated professional PLC control serves as a storage for definable processes and parameters.

V6-G Low-pressure plasma system

**Efficient batch system for removal of photoresist**
 
The batch system V10-G is designed for the removal of photoresists. Furthermore it can be optimally used for the cleaning of wafers.

**Areas of application**
- Ideal system for removing photoresist layers (also SU-8) after dry processes like RIE or Ion Beam etching as well as after high dose implant processes
- Silicon wafers or other substrate cleaning prior wet processing to achieve a better wettability for an uniform and efficient result
- Applicable for processes in MEMS and nano technology
- Polymer removal e.g. after Bosch processes
- Removal of organic sacrificial layers
Conditioning of bioactive compounds

V10-G Low-pressure Plasma System

**The system is integrated with rollers and height- adjustable feet.**

A professional PLC control unit serves as a storage for definable process parameters.

Standard systems for activation, cleaning, coating, etching
The system is integrated in a 19“ rack, which is equipped with rollers and height- adjustable feet.



V15-G Low-pressure plasma system

**Standard system for cleaning, activation and etching**
 
 The system V80-G is suitable for industrial production as well as for R&D applications in the laboratory sector.

The integrated professional SPS control serves as a storage for definable processes and parameters.

V80-G Low-pressure Plasma System

**For plasma treatment of flexible tapes**
 
 The reel-to-reel technology is a method especially developed for the plasma treatment of flexible tapes. The tape is continuously rewound from one reel to the other during the treatment. Transportation speed depends on the type of plasma process.


Plasma processes used for tape-shaped substrates are e.g. etching, activation, coating and cleaning. Plastic films as well as metal strips like lead frames can be processed. The processing of reel with interleaf (protective foil) is also possible.

Advanced Low-Pressure Plasma Systems for Versatile PCB Assembly Applications

Key Features:

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