Advanced Die Bonding Systems for Precision PCB Assembly

Our automatic Die Bonding systems, featuring the Model 6200, offer unmatched versatility in a compact and unique table-top configuration. Designed for precision and efficiency, this system supports a wide range of die attach processes, making it an ideal solution for advanced PCB assembly requirements.

Key Features:

Unmatched Versatility: The Model 6200 allows for the execution of a broad spectrum of die attach processes, including Epoxy Die Attach, various Eutectic processes, GGI using Ultrasonic or Thermo-compression, ACF/ACP, Ag Sintering, Die Stacking, and more. This versatility makes it suitable for diverse applications within a single machine.

High Placement Accuracy: Achieve exceptional placement accuracy, better than 3 microns (process dependent), thanks to advanced servo systems, a high-resolution digital vision system, and state-of-the-art Windows-based software. This precision ensures reliable and repeatable results in your PCB assembly process.

Wide Component Handling Capability: The system efficiently handles both active and passive components presented in 2″ and/or 4″ Waffle/Gel packs, various Tape & Reel feeders, and custom Trays. This capability ensures flexibility in component sourcing and handling, enhancing overall productivity.

Compact and Efficient Design: With its small and unique table-top configuration, the Model 6200 is perfect for environments where space is at a premium while still delivering high-performance die bonding capabilities.

Specification Highlights:

• Work Area up to 170 x 150 mm.
• Die size: 0.150 to over 50 mm.
• Die Thickness: from 50 µm.
• Die Aspect Ratio: over 1:50.
• Die Material: GaAs, Silicon, Glass, other.
• Die Presentation:
• Up to Ten 2” Waffle/Gel packs
• Up to 8 Tape & Reel feeders
• Volumetric, Time-Pressure, Jet or Other Dispensing.
• Single or Double Dispenser. Any combination of the above.
• Stamping (pin transfer) for dots as small as 75 µm.
• Cold or Hot process up to 500°C with Forming Gas cover.
• Heated pickup tool up to 500°C with Forming Gas.
• Ultrasonic bonding process available.
• Integrated Ag Sintering system.
• Integrated UV curing system.
• Programmable Bond Line Thickness control.
• Advanced Die Stacking capability.
• Pickup/Bond Force: 40 – 9000 grams.
• Placement Accuracy: better than ±3 µm depending on application.
• Throughput: up to 700 CPH depending on application.

Our Die Bonding systems are engineered to deliver precision, versatility, and efficiency, making them an essential tool for advanced PCB assembly. Trust in our technology to meet your exacting standards for die attach processes, ensuring high-quality and reliable production outcomes.