### Cutting Laser Systems for PCB Assembly

The MicroLine 5000 series is a cutting-edge solution for precision drilling and cutting in PCB assembly. With the ability to drill small holes with diameters as minute as 20 μm into various organic and inorganic substrates, it is ideal for applications such as through-hole drilling, blind vias, large mounting holes, and contour cutting of irregular PCB outlines.

![csm_Produkt_MicroLine_5000_4fc21dc758.png](/uploads/csm_Produkt_Micro_Line_5000_4fc21dc758_295966d2de.png)

#### Quality and Precision

The MicroLine 5000 utilizes a high-quality UV laser that ensures minimal thermal stress zones, even when cutting or drilling sensitive materials. This results in clean edges without dust or burrs. Equipped with powerful laser sources of 10 W, 15 W, and 27 W, the system can be configured to handle different material types and sizes, making it a versatile tool for any PCB assembly line.

#### Contour Cutting

In addition to its drilling capabilities, the MicroLine 5000 is designed for contour cutting of standard panel sizes up to 533 mm × 610 mm. With a cutting channel width of just 20 μm, this high-quality UV laser can handle even the most demanding contour cuts at high speeds, ensuring both efficiency and precision.

#### Advanced Process Monitoring

The MicroLine 5000 series is equipped with an integrated vision system that provides fast fiducial recognition for precise alignment. This camera system can utilize virtually any PCB feature as a fiducial mark, enhancing the accuracy of the cutting process. Additionally, an integrated power measurement system ensures reliable and repeatable laser power control at the material level, maintaining consistent quality across all cuts and drills.

#### Technical Specifications

**Max. Working Area:** 533 mm x 610 mm (21" x 24")
**Positioning Accuracy:** +/- 20 µm
**Diameter of Focused Laser Beam:** 20 µm
**System Dimensions (W x H x D):** 1660 mm x 1720 mm x 1900 mm (66" x 68" x 75")
**Weight:** Approx. 2000 kg
Height incl. status light = 2200 mm (87")

#### Available Variants
The MicroLine 5000 series offers two powerful variants:

#### MicroLine 5127

**Laser Power:** 27 W
**Wavelength:** 355 nm (UV)
**Pulse Duration:** Nano second
**Series:** 5000 series
**CleanCut:** Yes

#### PicoLine 5440

**Laser Power:** 40 W
**Wavelength:** 355 nm (UV)
**Pulse Duration:** Pico second
**Series:** 5000 series
**CleanCut:** Yes

The Cutting Laser Systems are engineered to deliver unmatched precision and quality in PCB manufacturing, making them an essential tool for any production line that demands high accuracy and reliability.

**MicroLine 5000-UV Laser System for Laser Drilling and Contour Cutting.**

The MicroLine 5000 is a laser drilling and cutting system specifically tailored to the needs of the flexible circuit industry. With the ability to drill holes down to 20 μm, a variety of both organic and inorganic substrates can be processed such as:
- Flexible PCBs
- IC substrates
- High Density Interconnect PCBs
- Available with either a 10 W, 15 W or 27 W laser source.

LPKF MicroLine 5000

**MicroLine 2000 P- Processing Flat Substrates.**
 
**UV Laser Cutting systems display their advantages at various positions in the production chain. With complex electronics components, the processing of flat materials is sometimes required.**
 
The LPKF MicroLine 2000 P is optimized for these work steps.
- Complex contours
- No substrate brackets or cutting tools
- More panels on the base material
- Perforations and decaps.
- The MicroLine 2000 P seamlessly integrates into existing manufacturing execution systems (MESs).

LPKF MicroLine 2000 P

**MicroLine 2000 S - Cutting Assembled Circuit Boards.**
**The UV Laser cuts substrates in the immediate vicinity of sensitive components or strip conductors - without mechanical stress.**

Smaller components can thus be produced with a noticeably higher assembly density up to the edge of the PCB - and at the same time the process reduces the reject rate.
- Circuit board thickness up to 1.6 mm
- Close to strip conductors or components
- Optimal utilization of the substrate.
- The MicroLine 2000 S seamlessly integrates into existing manufacturing execution systems (MESs).


LPKF MicroLine 2000 S

**LPKF MicroLine 2000 Ci - Automated UV Laser for Depaneling of Rigid and Flexible PCBs.**

The MicroLine 2000 Ci systems are remarkably compact, easy to operate, with a very good price performance ratio – a welcome addition to the electronic production team.

 In the MicroLine 2000 Ci, a highly developed vision system is used that can make corrections in the position and rotation angle of the component. The laser beam follows the contours of the real component position. 

The choice of available laser sources for the MicroLine 2000 platform has been expanded by a high power option for increased cutting performance.

The MicroLine 2000 Ci seamlessly integrates into existing manufacturing execution systems (MESs).

Cutting Laser Systems for PCB Assembly

Quality and Precision

Contour Cutting

Advanced Process Monitoring

Technical Specifications

Available Variants

MicroLine 5127

PicoLine 5440

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