Enhance Your PCB Assembly Process with Advanced 3D Solder Paste Inspection (SPI)
Our cutting-edge 3D Solder Paste Inspection (SPI) machines are designed to identify and rectify defects at the root cause, ensuring the highest quality in your PCB assembly process. With more than 60% of PCB defects originating in the front-end of the assembly process, our SPI systems offer a vital solution to optimize your production line and reduce errors.
Key Features:
3D SPI Technology: Utilize the latest 3D Solder Paste Inspection technology to accurately detect and measure solder paste deposits, ensuring precise and reliable results.
Laser Line Scan & Optical Methods: Choose between laser line scan and optical inspection methods, offering versatility and accuracy tailored to your specific needs.
Industry-Leading Inspection Speed: Benefit from the fastest inspection speed in the industry, minimizing downtime and maximizing production efficiency.
Real 3D Imaging: Gain unparalleled insight with real 3D imaging that provides detailed visualization of solder paste applications, enhancing defect detection capabilities.
Color and Material Irrelevant Inspection: Perform inspections that are unaffected by variations in color, material, or surface roughness, ensuring consistent and reliable results across different PCB types.
Automated PCB Warpage Measurement: Automatically measure PCB warpage, allowing for precise adjustments and ensuring optimal alignment during the assembly process.
Automated PCB Stretch and Shrinkage Compensation: Automatically compensate for PCB stretch and shrinkage, maintaining accuracy and consistency in your production line.
Process Optimization with Feedback & Feedforward Linkage: Optimize your assembly process with feedback and feedforward linkage support, allowing for real-time adjustments and improved overall performance.
Comprehensive Inspection Capabilities: Inspect a wide range of parameters including height, area, volume, offset, bridging, shape, PCB warpage, and PCB shrinkage, ensuring thorough quality control at every stage.
